TDK’s unique multi-layer manufacturing process enables us to create industry-leading RF components such as RF Inductors, filters, diplexers, triplexers, baluns and couplers with higher inductance and Q characteristics in small form factors. Our wire-wound technology uses high performing closed magnetic circuit with high permeability (μ) ferrite particles to enable lower Rdc values which reduce energy consumption. These components are designed for all types of high frequency applications ranging from consumer electronics and mobile phones to automotive. No matter what the application, TDK is there every step of the way to help our customers design and create innovative products for the next evolution of wireless technology.
Start your next design with the most accurate and well documented RF, Microwave and mm-Wave Simulation models in the industry! Modelithics passive and active, measurement-based simulation models integrate seamlessly with the latest electronic design automation (EDA) simulation tools.
Visit the Modelithics COMPLETE library for more information on the full capabilities and advantages of Modelithics high accuracy models. Our goal is to help you achieve first pass design success!
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Body Style | Max Freq (GHz) | Part Values | Downloads | Features |
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C0402C0G | CAP-TDK-01005-001 | 01005 | 30 | 0.2 pF -100 pF | SS: VS: PS: | ||
C0603C0G | CAP-TDK-0201-401 | 0201 | 20 | 0.2 - 100 pF | SS: PS: VS: | ||
C1005CH | CAP-TDK-0402-001 | 0402 | 15 | 0.5 pF - 33 pF | SS: PS: VS: | ||
C1005X5R | CAP-TDK-0402-002 | 0402 | 20 | 33 nF -220 nF | SS: VS: PS: | ||
C3225 | CAP-TDK-3225-001 | 3225 | 4 | 0.47-22uF | SS: VS: PS: | ||
CGA1A2C0G | CAP-TDK-0201-002 | 0201 | 50 | 1.0 – 100 pF | BB: SS: PS: VS: | ||
CGA1A2X7R | CAP-TDK-0201-002 | 0201 | 50 | 100 – 10,000 pF | BB: SS: PS: VS: | ||
CGB1T3X5R0J104M | CAP-TDK-0201-004 | 0201 | 50 | 0.1 uF | BB: SS: PS: VS: |
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Body Style | Max Freq (GHz) | Part Values | Downloads | Features |
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MHQ0402PSA | IND-TDK-01005-002 | 01005 | 30 | 0.4 - 22 nH | 3D: SP: PS: VS: | ||
MHQ1005P | IND-TDK-0402-003 | 0402 | 30 | 0.7 - 130 nH | 3D: SS: PS: VS: | ||
MHQ1005P |
IND-TDK-0402-103
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0402 | 50 | 0.7 - 130 nH | BB: SS: VS:PS: | ||
MLF2012 | IND-TDK-2012-001 | 2012 | 8 | 47-100,000 nH | SS: PS: VS: | ||
MLG0402Q | IND-TDK-01005-101 | 01005 | 24 | .2 - 33 nH | 3D: SS: VS: PS: | ||
MLG0603P | IND-TDK-0201-002 | 0201 | 24 | 0.6-120 nH | 3D: BB:SS: PS: VS: | ||
MLG0603S | IND-TDK-0201-101 | 0201 | 20 | 0.9 - 100 nH | 3D: SS: VS: | ||
MLG1005S | IND-TDK-0402-002 | 0402 | 12 | 1 - 390 nH | SS: VS: | ||
MLG1608B | IND-TDK-0603-002 | 0603 | 26 | 1.0 - 100 nH | SS: VS: | ||
MLG1608B | IND-TDK-0603-002-S | 0603 | 26 | 1 - 100 nH | BB: SS: VS: | ||
MLK1005S | IND-TDK-0402-001 | 0402 | 26 | 1.0 - 100 nH | SS: VS: | ||
NLV25T | IND-TDK-1008-101 | 1008 | 14 | 10-100000 nH | SS: VS: |
Title | Author | Date | |
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Modelithics® TDK MVP Library | Modelithics, Inc. | 8/12/2019 |
Title | Author | Date | Example File | |
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Take Advantage of 3D EM Simulation for Densely Packed Designs | Modelithics, Inc. | 5/2/2022 | |
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EM Co-Simulation with Measurement-Based Models Leads to First-Pass Design Success | ERIC VALENTINO, RF Engineer, and CHRIS DEMARTINO, Sales and Applications Engineer, Modelithics | 2/21/2020 |
Title | Author | Date | Example | |
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Understanding S-Parameter Vs. Equivalent Circuit-based Models For RLC Component Simulations In Keysight ADS And Genesys | Modelithics: Scott Skidmore, Laura Levesque, And Scott Muir, Along With Jason Boh And How-siang of Keysight Technologies | 12/4/2014 | |
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Understanding S-Parameter Vs Equivalent Circuit-based Models For RLC Component Simulations With NI/AWR Microwave Office | Modelithics, Inc. | 11/20/2014 |
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Modelithics® and TDK Partner to Offer 79 New 3D EM Inductor Models | Modelithics, Inc. | 1/12/2021 |
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Modelithics Welcomes TDK as a Sponsoring MVP | Modelithics, Inc. | 8/25/2019 |
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Are 3D EM Models a Necessity or a Redundancy? | Modelithics, Inc. | 3/23/2022 |
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TDK Print Ad April 2020 | Modelithics, Inc. | 4/1/2020 |
Title | Author | Date | |
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Modelithics® and TDK Partner to Offer 79 New 3D EM Inductor Models | Modelithics, Inc. | 1/12/2021 |
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Modelithics Welcomes TDK as a Sponsoring MVP | Modelithics, Inc. | 8/25/2019 |