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Modelithics TDK MVP Model Listing

 

Modelithics Vendor Partner



TDK’s unique multi-layer manufacturing process enables us to create industry-leading RF components such as RF Inductors, filters, diplexers, triplexers, baluns and couplers with higher inductance and Q characteristics in small form factors. Our wire-wound technology uses high performing closed magnetic circuit with high permeability (μ) ferrite particles to enable lower Rdc values which reduce energy consumption. These components are designed for all types of high frequency applications ranging from consumer electronics and mobile phones to automotive. No matter what the application, TDK is there every step of the way to help our customers design and create innovative products for the next evolution of wireless technology.

Start your next design with the most accurate and well documented RF, Microwave and mm-Wave Simulation models in the industry! Modelithics passive and active, measurement-based simulation models integrate seamlessly with the latest electronic design automation (EDA) simulation tools.

Visit the Modelithics COMPLETE library for more information on the full capabilities and advantages of Modelithics high accuracy models. Our goal is to help you achieve first pass design success!


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Modelithics TDK MVP Library
 
More Info Part Number Model Body Style Max Freq (GHz) Part Values Downloads Features
C0402C0G CAP-TDK-01005-001 01005 30 0.2 pF -100 pF SS: VS: PS:
C0603C0G CAP-TDK-0201-401 0201 20 0.2 - 100 pF SS: PS: VS:
C1005CH CAP-TDK-0402-001 0402 15 0.5 pF - 33 pF SS: PS: VS:
C1005X5R CAP-TDK-0402-002 0402 20 33 nF -220 nF SS: VS: PS:
C3225 CAP-TDK-3225-001 3225 4 0.47-22uF SS: VS: PS:
CGA1A2C0G CAP-TDK-0201-002 0201 50 1.0 – 100 pF BB: SS: PS: VS:
CGA1A2X7R CAP-TDK-0201-002 0201 50 100 – 10,000 pF BB: SS: PS: VS:
CGB1T3X5R0J104M CAP-TDK-0201-004 0201 50 0.1 uF BB: SS: PS: VS:

Legend

 
3D
3D Model
BB
Broadband Component
BW
Bondwire de-embedding
FL
Flicker Noise (1/F)
IM
3rd order IMD validated
LP
Load Pull
NL
Non-Linear
NP
Noise Parameter
Not recommended for new designs
OS
Orientation Selectable
PD
Pad De-embedding
PS
Pad Scaling
SP
S-Parameter Data Model
SS
Substrate Scalable
SM
Super Model
TS
Temperature Scalable
VS
Part Value Scalable/Selectable
XP
X-Parameter Data Model
More Info Part Number Model Body Style Max Freq (GHz) Part Values Downloads Features
MHQ0402PSA IND-TDK-01005-002 01005 30 0.4 - 22 nH 3D: SP: PS: VS:
MHQ1005P IND-TDK-0402-003 0402 30 0.7 - 130 nH 3D: SS: PS: VS:
MHQ1005P IND-TDK-0402-103 0402 50 0.7 - 130 nH BB: SS: VS:PS:
MLF2012 IND-TDK-2012-001 2012 8 47-100,000 nH SS: PS: VS:
MLG0402Q IND-TDK-01005-101 01005 24 .2 - 33 nH 3D: SS: VS: PS:
MLG0603P IND-TDK-0201-002 0201 24 0.6-120 nH 3D: BB:SS: PS: VS:
MLG0603S IND-TDK-0201-101 0201 20 0.9 - 100 nH 3D: SS: VS:
MLG1005S IND-TDK-0402-002 0402 12 1 - 390 nH SS: VS:
MLG1608B IND-TDK-0603-002 0603 26 1.0 - 100 nH SS: VS:
MLG1608B IND-TDK-0603-002-S 0603 26 1 - 100 nH BB: SS: VS:
MLK1005S IND-TDK-0402-001 0402 26 1.0 - 100 nH SS: VS:
NLV25T IND-TDK-1008-101 1008 14 10-100000 nH SS: VS:

Legend

 
3D
3D Model
BB
Broadband Component
BW
Bondwire de-embedding
FL
Flicker Noise (1/F)
IM
3rd order IMD validated
LP
Load Pull
NL
Non-Linear
NP
Noise Parameter
Not recommended for new designs
OS
Orientation Selectable
PD
Pad De-embedding
PS
Pad Scaling
SP
S-Parameter Data Model
SS
Substrate Scalable
SM
Super Model
TS
Temperature Scalable
VS
Part Value Scalable/Selectable
XP
X-Parameter Data Model

Model Listing

Application Note

  Note # Title Date Example Files
82 Comparing Planar EM/Circuit Co-Simulation with 3D EM Simulation for Designs with Closely Spaced Surface-Mount Components 5/23/2022
79 Filter Design Flow in Ansys Electronics Desktop with Modelithics Substrate Scalable Models 12/6/2021
69 Utilizing Substrate Scalability of Modelithics Microwave Global Models™ in Ansys® Electronics Desktop 10/14/2020
68 Utilizing Substrate Scalability of Modelithics Models in Cadence AWR Design Environment 9/18/2020
52 A Design Flow for Rapid and Accurate Filter Prototyping 6/29/2015
51 AXIEM Co-Simulation with Modelithics Models 6/23/2015
50 Good, Better And Best: Techniques For Achieving First Pass Success In Lumped Element Pcb -Based Filter Designs 3/18/2015
48 Recommendations For Port Setup When Using ADS Momentum And Modelithics Models 1/1/2014
46 Improved Microwave Circuit Design Flow Through Passive Model Yield And Sensitivity Analysis 1/1/2014
43 Modelithics Substrate Library For Genesys Adds Accuracy And Convenience To Board-Based Designs 1/1/2014
39 Accurate Co-Simulation Of Surface-Mount Capacitors In Shunt Configurations 1/1/2014
37 Performing Em-Circuit Co-Simulation With Modelithics Models Using Sonnet Suites 1/1/2014
36 Effects Of Over-Molding On Surface Mount Capacitors And Inductors 1/1/2014
35 Proximity Effects In Closely-Spaced Surface Mount Passive Components 1/1/2014
29 Lumped Element Low-Pass Filter Design And Optimization Using Agilent Genesys Software 1/1/2014
26 Capacitor PI Network For Impedance Matching 1/1/2014
25 The Importance Of Pad Geometry In Maximizing Surface Mount Component Performance (Also Published Electronically By RF Globalnet) 1/1/2014
22 Part Value Tolerance In Surface Mount Components 1/1/2014
21 Filter Design Using 0201 Surface Mount LC'S 1/1/2014
20 Lumped Element Band-Pass Filter Design And Optimization 1/1/2014
19 Lumped Element High-Pass Filter Design And Optimization 1/1/2014
18 Lumped Element Low-Pass Filter Design And Optimization 1/1/2014
17 Lumped Element Filter Design And Optimization 1/1/2014
15 Reducing Part Count In Low-Pass Filter Designs 1/1/2014
14 Capacitor Tee Network Characteristics 1/1/2014

Brochures

  Title Author Date
Modelithics® TDK MVP Library Modelithics, Inc. 8/12/2019

Published Articles

  Title Author Date Example File
Take Advantage of 3D EM Simulation for Densely Packed Designs Modelithics, Inc. 5/2/2022
EM Co-Simulation with Measurement-Based Models Leads to First-Pass Design Success ERIC VALENTINO, RF Engineer, and CHRIS DEMARTINO, Sales and Applications Engineer, Modelithics 2/21/2020

White Papers (Registration not required)

  Title Author Date Example
Understanding S-Parameter Vs. Equivalent Circuit-based Models For RLC Component Simulations In Keysight ADS And Genesys Modelithics: Scott Skidmore, Laura Levesque, And Scott Muir, Along With Jason Boh And How-siang of Keysight Technologies 12/4/2014
Understanding S-Parameter Vs Equivalent Circuit-based Models For RLC Component Simulations With NI/AWR Microwave Office Modelithics, Inc. 11/20/2014


Press Release

  Title Author Date
Modelithics® and TDK Partner to Offer 79 New 3D EM Inductor Models Modelithics, Inc. 1/12/2021
Modelithics Welcomes TDK as a Sponsoring MVP Modelithics, Inc. 8/25/2019

Blogs

  Title Author Date
Are 3D EM Models a Necessity or a Redundancy? Modelithics, Inc. 3/23/2022

Print Ads

  Title Author Date
TDK Print Ad April 2020 Modelithics, Inc. 4/1/2020

Press Release

  Title Author Date
Modelithics® and TDK Partner to Offer 79 New 3D EM Inductor Models Modelithics, Inc. 1/12/2021
Modelithics Welcomes TDK as a Sponsoring MVP Modelithics, Inc. 8/25/2019