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World’s Best RF & Microwave Simulation Models
Modelithics Smiths Interconnect MVP Model Listing
 


Smiths Interconnect is synonymous with exceptional performance whenever a technologically advanced, high quality connectivity solution is required to ensure reliability and safety in demanding applications.

Smiths Interconnect’s extensive product portfolio includes high reliability electrical connectors and cable assemblies, antenna systems, test sockets and probe card solutions, and a wide range of RF and microwave components.

Start your next design with the most accurate and well documented RF, Microwave and mm-Wave Simulation models in the industry! Modelithics passive and active, measurement-based simulation models integrate seamlessly with the latest electronic design automation (EDA) simulation tools, including Keysight Technologies’ Advanced Design System (ADS), NI AWR Design Environment/Microwave Office™, Keysight Technologies’ Genesys, ANSYS® HFSS™, Sonnet® and Cadence.

Modelithics high accuracy models capture parasitic effects and reliably predict how component performance changes with various scalable input parameters over a specified frequency range. The scaling and optimization features provide advanced analysis capability and allow RF circuit designers to quickly meet design goals. Visit the products page for more information on the advantages of Modelithics models. Our goal is to help you achieve first pass design success!


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More Info Part Number Model Body Style Max Freq (GHz) Part Values Downloads Features
TT9 ATT-SINT-TT9-001 SMT 30 0 - 10 dB VS, SS

Legend

 
3D
ANSYS HFSS 3D Model
BB
Broadband Component
BW
Bondwire de-embedding
FL
Flicker Noise (1/F)
IM
3rd order IMD validated
LP
Load Pull
NL
Non-Linear
NP
Noise Parameter
Not recommended for new designs
OS
Orientation Selectable
PD
Pad De-embedding
PS
Pad Scaling
SP
S-Parameter Data Model
SS
Substrate Scalable
SM
Super Model
TS
Temperature Scalable
VS
Part Value Scalable/Selectable
XP
X-Parameter Data Model
More Info Part Number Model Body Style Max Freq (GHz) Part Values Sparameters Features
CE_XXXX_N_XXX_SMTF FEQ-SINT-CExxxxN0xxSMTF-001 Chip 20 S-Parameters VS

Legend

 
3D
ANSYS HFSS 3D Model
BB
Broadband Component
BW
Bondwire de-embedding
FL
Flicker Noise (1/F)
IM
3rd order IMD validated
LP
Load Pull
NL
Non-Linear
NP
Noise Parameter
Not recommended for new designs
OS
Orientation Selectable
PD
Pad De-embedding
PS
Pad Scaling
SP
S-Parameter Data Model
SS
Substrate Scalable
SM
Super Model
TS
Temperature Scalable
VS
Part Value Scalable/Selectable
XP
X-Parameter Data Model
More Info Part Number Model Body Style Max Freq (GHz) Part Values Downloads Features
CRxxxxD RES-SINT-CRxxxxD_100-001 Various 30 100 Ohms S-Parameters VS
CTxxxxD RES-SINT-CTxxxxD_050-001 Various 30 50 Ohms S-Parameters VS

Legend

 
3D
ANSYS HFSS 3D Model
BB
Broadband Component
BW
Bondwire de-embedding
FL
Flicker Noise (1/F)
IM
3rd order IMD validated
LP
Load Pull
NL
Non-Linear
NP
Noise Parameter
Not recommended for new designs
OS
Orientation Selectable
PD
Pad De-embedding
PS
Pad Scaling
SP
S-Parameter Data Model
SS
Substrate Scalable
SM
Super Model
TS
Temperature Scalable
VS
Part Value Scalable/Selectable
XP
X-Parameter Data Model

Model Listing