Gowanda Components Group (GCG) is a US-based manufacturer of high performance electronic components that support the needs of electronic design engineers around the world. Areas of expertise include magnetic devices, specialty filters and custom-designs. These products enhance the performance and reliability of electronic systems in space flight, aerospace, commercial, communication, defense and medical applications.
The individual business units that support GCG are Gowanda Electronics, Communication Coil, TTE Filters and Instec Filters. With a combined history of 170+ years in business, these organizations have earned a well-respected and important presence within the global electronics industry.
Start your next design with the most accurate and well documented RF, Microwave and mm-Wave Simulation models in the industry! Modelithics passive and active, measurement-based simulation models integrate seamlessly with the latest electronic design automation (EDA) simulation tools, including Keysight Technologies’ Advanced Design System (ADS), NI AWR Design Environment/Microwave Office™, Keysight Technologies’ Genesys, ANSYS® HFSS™ and Sonnet®.
Modelithics high accuracy models capture parasitic effects and reliably predict how component performance changes with various scalable input parameters over a specified frequency range. The scaling and optimization features provide advanced analysis capability and allow RF circuit designers to quickly meet design goals. Visit the products page for more information on the advantages of Modelithics models. Our goal is to help you achieve first pass design success!
|More Info||Part Number||Model||Body Style||Max Freq (GHz)||Part Values||Downloads||Features|
|C050SMC||INDSP-GOW-C050SMC-001||Conical||42||0.23 and 0.4 uH||S-Parameters||SP|
|C100FL||INDSP-GOW-C100FL-001||Conical||40||1.0 and 1.54 uH||S-Parameters||SP|
|C100SM||INDSP-GOW-C100SM-001||Conical||40||0.26, 0.44, 0.69 and 1.0 uH||S-Parameters||SP|
|C225FL||INDSP-GOW-C225FL-001||Conical||40||0.89, 1.3, 2.4, 3.8 and 8 uH||S-Parameters||SP|
|CC0603||INDSP-GOW-0603-001||0603||20||4.7, 5.1 and 5.6 nH||S-Parameters||SP|
|Note #||Title||Date||Example Files|
|52||A Design Flow for Rapid and Accurate Filter Prototyping||6/29/2015|
|51||AXIEM Co-Simulation with Modelithics Models||6/23/2015|
|50||Good, Better And Best: Techniques For Achieving First Pass Success In Lumped Element Pcb -Based Filter Designs||3/18/2015|
|48||Recommendations For Port Setup When Using ADS Momentum And Modelithics Models||1/1/2014|
|46||Improved Microwave Circuit Design Flow Through Passive Model Yield And Sensitivity Analysis||1/1/2014|
|39||Accurate Co-Simulation Of Surface-Mount Capacitors In Shunt Configurations||1/1/2014|
|37||Performing Em-Circuit Co-Simulation With Modelithics Models Using Sonnet Suites||1/1/2014|
|36||Effects Of Over-Molding On Surface Mount Capacitors And Inductors||1/1/2014|
|35||Proximity Effects In Closely-Spaced Surface Mount Passive Components||1/1/2014|
|29||Lumped Element Low-Pass Filter Design And Optimization Using Agilent Genesys Software||1/1/2014|
|26||Capacitor PI Network For Impedance Matching||1/1/2014|
|25||The Importance Of Pad Geometry In Maximizing Surface Mount Component Performance (Also Published Electronically By RF Globalnet)||1/1/2014|
|22||Part Value Tolerance In Surface Mount Components||1/1/2014|
|21||Filter Design Using 0201 Surface Mount LC'S||1/1/2014|
|20||Lumped Element Band-Pass Filter Design And Optimization||1/1/2014|
|19||Lumped Element High-Pass Filter Design And Optimization||1/1/2014|
|18||Lumped Element Low-Pass Filter Design And Optimization||1/1/2014|
|17||Lumped Element Filter Design And Optimization||1/1/2014|
|15||Reducing Part Count In Low-Pass Filter Designs||1/1/2014|
|14||Capacitor Tee Network Characteristics||1/1/2014|