CEL

Modelithics Global Models ™ reliably track how each component's performance will change with substrate characteristics, as illustrated in the Global Model data sheet for the component. Global Models automatically scale all substrate-sensitive parasitics with nominal part value, enabling a single model to generate accurate simulations of a complete component family. The data sheet also demonstrates the excellent measured-to-modeled agreement that can be expected using this model with the appropriate pads and substrate settings.

Global Models are available for Agilent EEsof ADS, AWR Microwave Office, Ansoft Designer, and Eagleware-Elanix GENESYS. The models listed below can be purchased individually, as part of the Modelithics NLT Library.

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Vendor Part Number Modelithics Part Number Device Type Body Style Global Part Values Upr Validation Freq (GHz) Example Data Features
NE3210S01 HMT-NEC-NE3210S01 PHEMT S01 30 NL, NP, IM
NE350184C HMT-NEC-NE350184C PHEMT 84C 30 NL, NP, IM
NE38018 MES-CEL-NE38018 MESFET SOT343 12 NL, NP, SS
NE41607 BJT-NEC-NE41607 BJT 4-pin Outline 10 NL, SS, TS, NP, LP, PD
NE5511279A MOS-NEC-NE5511279A LDMOS FET 79A 2 NL, LP
NE5520379A MOS-NEC-NE5520379A LDMOSFET 79A 2 NL, LP
NE552R679A MOS-NEC-NE552R679A LDMOSFET 79A 2 NL, LP
NE68519 BJT-NEC-NE68519 BJT 3pin Ultra super mini mold 6 NL, SS, TS, FL
NE68533 BJT-NEC-NE68533 BJT SOT23 6 NL, SS, FL
NE722S01 MES-NEC-NE722S01 MESFET S01 30 NL
NE851M13 BJT-NEC-NE851M13 BJT M13 6 NL, SS, FL, NP
NE85608 BJT-NEC-NE85608 BJT Outline 35 10 NL, SS, TS, NP, LP, PD
NE85633 BJT-NEC-NE85633 BJT SOT23 6 NL, SS, NP, FL
NE85633 BJT-NEC-NE85633-101 BJT SOT23 6 NL, SS, TS, FL
NESG303100 HBT-NEC-NESG303100-001-S Transistor 24 NL, NP, FL
NESG303100G HBT-NEC-NESG303100 HBT Chip 24 NL, NP, FL
NESG3031M05 HBT-NEC-NESG3031M05 HBT M05, 2012 6 NL, NP, FL
uPC8179TK-E2-A AMP-NEC-UPC8179TK-001 Amplifier MMIC NL, SS

Legend
BB - Broad Band Capacitor      FL - Flicker Noise (1/F)      IM - 3rd order IMD validated      LP - Load Pull      NL - Non-Linear      NP - Noise Parameter      PD - Pad de-embedding
OS - Orientation Selettable     PS - Pad Scaling             SS - Substrate Scalable             TS - Temperature Scalable      VS - Part Value Scalable/Selectable      BW - Bondwire de-embedding