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Modelithics™ Models for MicroMetrics Components
Modelithics high accuracy measurement-based models reliably track how component performance will change with various input parameters over a specified frequency range documented in a model information data sheet for each component. Modelithics surface-mount diode models covers varactor, Schottky and PIN diodes of different capacitance ranges and package sizes. The equivalent circuit models are extracted from precision DC-IV, capacitance and S-parameter measurements. The models also include features such as substrate scaling, and are validated over temperature and RF input power. Shown on this page are specific Micrometric diode models developed for the benefit of designers seeking improved simulation accuracy and more rapid design success.The models listed below can be purchased individually or as part of the complete Modelithics NLD non-linear diode model library.
Model Download and Quotation Request - Complimentary (free) use available to qualified requestors.
To purchase Modelithics Library Models, or for more information, please contact: sales@modelithics.com or call 813.866.6335.
For more information on Aeroflex-Metelics semiconductor(MicroMetrics) products or to request samples please contact Cindy Lien or Donna Langan.
| Vendor Part Number | Modelithics Part Number | Device Type | Body Style | Upr Validation Freq (GHz) | Example Data | Features |
| 7100 | PIN-MIM-VARP-001 | Pin | Chip or CS19-1 | 10 | S-Parameters | NL, TS |
| 7101 | PIN-MIM-VARP-004 | Pin | Chip | 10 | S-Parameters | NL, TS |
| 7110 | PIN-MIM-VARP-002 | Pin | Chip or CS19-1 | 10 | S-Parameters | NL, TS |
| 7120 | PIN-MIM-VARP-003 | Pin | Chip or CS19-1 | 10 | S-Parameters | NL, TS |
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PIN-MIM-MMP-101 - NLD PIN-MIM-MMP-001 - NLD | PIN | Chip | 20 | NL, TS | |
| MSSP25250-70 | PIN-MIM-0603-001 | PIN | 0603 | 14 | NL |
Legend
BB - Broad Band Capacitor     FL - Flicker Noise (1/F)     IM - 3rd order IMD validated     LP - Load Pull     NL - Non-Linear     NP - Noise Parameter     PD - Pad de-embedding
OS - Orientation Selettable PS - Pad Scaling       SS - Substrate Scalable   TS - Temperature Scalable     VS - Part Value Scalable/Selectable     BW - Bondwire de-embedding
